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CERAMIC PROCESSING
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Milling
Partial milling of ceramic cavities to countersink bare dice
Advantages
- shorter wire bond connections
- optimal heat dissipation
Cutting
Cuttings with any geometries
- to countersink bare dice, in combination with a chip carrier or heatsink
- to realize capacious through holes for power applications
Advantages
- shorter wire bond connection
- optimal heat dissipation
Drilling and Scribing
Drilling of ceramics for high quality holes as well as precise scribe lines with small tolerances
(min. +50 / -25 microns)
Advantages
- narrow profile of the hole edges, slight taper
- excellent metallization of the drilled holes
- improved quality of the scribed edges in comparison to CO2-Laser
Sawing
Sawing of ceramics or other substrates with a wafer saw
Advantages
- sawing of very thin or thick as well as small sized substrates
- outer edges of high quality with close tolerances (±15 microns)
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